Computational Fluid Dynamics
Multiple Levels of Analysis
complete systems and their many sub-components
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FAN CFD MODELING
Fans are widely used in various industries such as aerospace, computing, electronics cooling and HVAC. Cofan is able to provide CFD driven simulation for optimization of Axial and Centrigugal Fans as well as Blowers and impellers. The simulation can be carried out either as a single component, as part of a heatsink assembly or as part of a system-wide analysis.
The simulation goal is to optimize fan performance. This optimization process includes analyzing the each of the fan components, such as blade geometry, number of blades, blade twist angle and blade chord length and fan housing, in order to achieve the maximum flow rate within a finite volumetric size.
Axial Fans | Blowers | Centrifugal
HEATSINK / THERMAL OPTIMIZATION
|Heatsinks are crucial components used to dissipate heat from electronic devices, machinery, and electronic systems. Heatsink optimization using Cofan's CFD as a Service (CFDaaS) involves designing and refining the heatsinks design to enhance their thermal performance within a specific ecosystem. Cofan CFDaaS simulations defines the physics of fluid flow and heat transfer and can help engineers optimize heatsink designs for improved heat transfer efficiency, reduced thermal resistance, and overall better thermal management. The process involves specifying the boundary conditions such as heat sources, inlet/outlet conditions, and material properties for the heatsink and surrounding components.
|Thermal optimization involves using Cofan's CFDaaS design process simulations to optimize the thermal performance by taking the specified boundary conditions and analyzing the heat transfer processes. The simulation performs a sensitivity analyses to understand how variations in design parameters affect the heatsink thermal performance. By analysing the simulation results, the heat transfer rate, thermal resistance temperature distributions, heat fluxes, and fluid flow patterns around the heatsink can be calculated and our team would propose design changes to optimize the heatsink. This could involve adjusting fin geometry, increasing/decreasing fin density, modifying fin shape, or altering the baseplate design. The simulations allows the design engineer to visualize how heat is transferred from the heat source to the surrounding ambient environment.
PCB THERMAL DESIGN
|Thermal analysis of printed circuit boards (PCBs) is a crucial aspect of electronic designs. PCBs generate heat components such as microprocessors, power electronics, and other active elements. Excessive heat can lead to component failure, reduced performance, and even complete system malfunction. Our CFD analysis identifies potential hotspots on the PCB and test / optimize dissipation solutions to ensure reliable operation
Cofan's CFDaaS process identifies hotspot (regions with elevated temperatures) overall temperature distributions, heat fluxes, and airflow patterns around components that could potentially lead to component failures or reduced lifespan. By effectively managing heat dissipation, engineers can prevent thermal failures, extend component lifetimes, and enhance the overall performance and durability of electronic systems. Based on simulation insights, a cooling strategy is developed to address hotspots on the PCB. This could involve adding heatsinks, heat spreaders, thermal pads, thermal vias, component relocatiion or optimizing airflow paths.
LED Light Source Products, Video Cards, PCIe Products, PCB's (Metal Core & Single Board Computers, Memory Cards, Conduction Cooling, Heatpipes & Vapor Chambers, Graphic Cards, . . . and more
COMPONENT LEVEL ANALYSIS
Integrated circuits generate heat primarily due to resistive losses in conducting materials and active semiconductor devices (transistors, diodes, etc.). Power dissipation is a key factor in determining how much heat a component generates. Excessive heat can lead to performance degradation, reliability issues, and even permanent damage to the components and is essential to prevent overheating and impact long-term reliability and performance of electronic devices.
Proper thermal design can extend the lifespan and reliability of IC components and improve their overall system efficiency. Cofan's CFDaaS is able to produce a accurate thermal model of integrated circuit (IC) components. Through our design process, a proper simulation analysis aided by selecting the appropriate heatsink, thermal Interface material and materials will help to maintain lower component junction temperatures.