BGA Heatsink

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COFAN’S BGA heatsinks are high efficiency cooling products designed to serve today's leading edge processor and memory chip applications. Our website makes it easy to quickly configure the right solution to meat your needs.
Alloy Aluminum or Copper
Finish Anodized or Black Powder Coat (Consult for Custom Requests)
Type Plate Fine, Cross Ctu (loose) or Cross Cut (Tight)
Footprint 17~49mm Baseplate Footprints (standard)
Heights 10~40mm height (standard)
Interface Optional Thermal Pad
Mounting Optional Screw, Spring-Loaded, Clip and Z-Clip Mounting Options

Use the fields below to configure your part number:

* Please be sure to follow configuration rules in the Datasheet, we will confirm your configuration with the factory as soon as possible.