BGA Heatsink

Download bga.pdf
COFAN’S BGA heatsinks are high efficiency cooling products designed to serve today's leading edge processor and memory chip applications. Our website makes it easy to quickly configure the right solution to meat your needs.
Alloy Aluminum or Copper
Finish Anodized or Black Powder Coat (Consult for Custom Requests)
Type Plate Fine, Cross Ctu (loose) or Cross Cut (Tight)
Footprint 17~49mm Baseplate Footprints (standard)
Heights 10~40mm height (standard)
Interface Optional Thermal Pad
Mounting Optional Screw, Spring-Loaded, Clip and Z-Clip Mounting Options

Use the fields below to configure your part number:

* Please be sure to follow configuration rules in the Datasheet, we will confirm your configuration with the factory as soon as possible.

About the Company

Established in 1994, COFAN USA provides advanced thermal solutions like AC Fans, DC Fans, Blowers and Impellers.  Engineering and fabrication services combined in our local facilities with ability to transition volume production to our manufacturing locations in Taiwan, China, or Korea make Cofan an ideal partner for your thermal assembly requirements.

Get in Touch

Cofan-USA
Corporate Headquarters
48664 Milmont Dr.
Fremont, CA 94538


+ (510) 490-7533
info@cofan-usa.com