BGA Heatsink
COFAN’S BGA heatsinks are high efficiency cooling products designed to serve today's leading edge processor and memory chip applications. Our website makes it easy to quickly configure the right solution to meat your needs.
| Alloy | Aluminum or Copper |
|---|---|
| Finish | Anodized or Black Powder Coat (Consult for Custom Requests) |
| Type | Plate Fine, Cross Ctu (loose) or Cross Cut (Tight) |
| Footprint | 17~49mm Baseplate Footprints (standard) |
| Heights | 10~40mm height (standard) |
| Interface | Optional Thermal Pad |
| Mounting | Optional Screw, Spring-Loaded, Clip and Z-Clip Mounting Options |
Use the fields below to configure your part number:
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* Please be sure to follow configuration rules in the Datasheet, we will confirm your configuration with the factory as soon as possible.