What Are Vapor Chambers?
A vapor Chamber is a planer heat pipe, which can spread heat in two dimensions. They are typically used in high heat flux applications, or when two-dimensional spreading is required. Vapor Chamber technology enables higher CPUs with a higher TDP (or overclocked state) to be efficiently and effectively cooled to safe operating temperatures, extending component and product life. As shown in the diagram, vapor chamber features a wick design that filled with coolant. When heated, the coolant changes phase from a liquid to a gas and back again to transfer heat.
Benefits of Vapor Chamber
- Elimination of hot spot
- Better fin efficiency and equilibrium temperature
- Size: 350 mm x 350 mm
- Stickiness: 0.5 mm – 5.0 mm
- Shape: Base on stamping and bending limitation
Heat Pipe VS. Vapor Chamber
|Heat Pipe||VS||Vapor Chamber|
|Long distance heat transfer, light weight, suitable for large demand consumer productions||Application||Suitable for large heat flux, high density and high power system, and a great alternative from liquid cooling|
|Round, flattened or bent in different direction||Shape||Complex Shape in X and Y direction with pedestals|
|Additional fixture plate/clamps||Fixtures||Though hole in vapor chamber|
|A base plate required to contact the heat source unless flattened/machine direct tough||Cource Contact||Direct contact. Mounting pressure up to 90 psi|
|∅5 > 20 W; ∅6 > 40 W; ∅8 > 60 W||Qmax||T= 5 mm > 1500 W; T= 3 mm > 500 W; T= 1 mm > 60 W|
|Flexible in shape design, low cost, mature supply chain||Advantage||Better anti-gravity result, support high power in limited space, fast spreading, high reliability|