Vapor Chambers

What Are Vapor Chambers?

A vapor Chamber is a planer heat pipe, which can spread heat in two dimensions. They are typically used in high heat flux applications, or when two-dimensional spreading is required. Vapor Chamber technology enables higher CPUs with a higher TDP (or overclocked state) to be efficiently and effectively cooled to safe operating temperatures, extending component and product life. As shown in the diagram, vapor chamber features a wick design that filled with coolant. When heated, the coolant changes phase from a liquid to a gas and back again to transfer heat.

Benefits of Vapor Chamber

  • Elimination of hot spot
  • Better fin efficiency and equilibrium temperature

Limitations

  • Size: 350 mm x 350 mm
  • Stickiness: 0.5 mm – 5.0 mm
  • Shape: Base on stamping and bending limitation


Heat Pipe VS. Vapor Chamber

Heat Pipe VS Vapor Chamber
Long distance heat transfer, light weight, suitable for large demand consumer productions Application Suitable for large heat flux, high density and high power system, and a great alternative from liquid cooling
Round, flattened or bent in different direction Shape Complex Shape in X and Y direction with pedestals
Additional fixture plate/clamps Fixtures Though hole in vapor chamber
A base plate required to contact the heat source unless flattened/machine direct tough Cource Contact Direct contact. Mounting pressure up to 90 psi
∅5 > 20 W; ∅6 > 40 W; ∅8 > 60 W Qmax T= 5 mm > 1500 W; T= 3 mm > 500 W; T= 1 mm > 60 W
Flexible in shape design, low cost, mature supply chain Advantage Better anti-gravity result, support high power in limited space, fast spreading, high reliability


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